PRODUCT

Package structure

Soft material can be used directly in CMOS lens moduleShort bonding distance on soft materials reduces high-frequency interference

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Ultra-thin wafer carrier

To increase the thickness of the wafer, the carrier used must be adsorbedAnd separation are very easy to handle

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External rotation shaftless fan blade structure/h3>

Innovative design of externally rotating shaftless blade structure with concentrated wind

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Optical device module structure

Optical device module structure

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Process Technology